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AlN Substrate

≥180 W/m·k

Thermal Conductive

≥380 Mpa

Bending Strength

3.30-3.36 g/cm3

Density

Ra 0.02-0.5 μm

Surface Roughness

<1.5‰

Warpage

AlN Substrate

Ascendus uses tape casting process to produce substrates.

We developeddifferent subdivisions in order to meet different metallization requests for different applications


Advantages

Standard thermal conductivity:≥170W/m·k

High thermal conductivity:≥200W/m·k

Varieties of matallizations:DPC,DBC,TPC,AMB,Thick Film,Thin Film

Ultra thin:0.15mm

Reliable quality control


Parameters

ITEM

UNIT

As-fired

Color

-

Gray/Beige

Thermal Conductivity

[@20℃] W/m·k

≥170

Bending Strength

MPa

>350

Surface Roughness

μm

0.02-0.7

Warpage

<2.5

Volume Density

g/cm3

≥3.24

Coefficient of Linear Expansion

 [RT-300℃] 10-6mm/℃

4.6

Volume Resistance

Ω·cm

1.5×1013

Dielectric   Constant

[@1MHz]

10.6

Dielectric   Loss  

 [@1MHz]

4.6×10-4

Dielectric   Strength

(KV/mm)

≥20


Standard Size

Thickness

(mm)

Size(inch)

2*2

4*4

4.5*4.5

5*5

5.5*7.5

6*6

0.15

-

-

-

0.25

-

-

-

0.381



0.5

0.635

1

1.5

2

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